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Foshan Qiruide Additives Co,.Ltd

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Acid Copper Plating Additives

Acid Copper Plating Additives

Offering quality acid copper plating additives customized service, QIRUIDE is well-known as one of the leading manufacturers and suppliers in China. In past years, we have gathered many professional personnel and introduced advanced equipment. You can be free to buy cheap and quality products at...

Product Details

Offering quality acid copper plating additives customized service, QIRUIDE is well-known as one of the leading manufacturers and suppliers in China. In past years, we have gathered many professional personnel and introduced advanced equipment. You can be free to buy cheap and quality products at low price with us.

EXULTRA ACID COPPER PLATING PROCESS

1. Advantages

Excellent brightening and leveling ability    

Great throwing power with good leveling in LCD area     

No pitting deposit with good ductility and corrosion resistance

This process is very easy to control with stable bath, and lower maintaining cost

Suitable for all kinds of parts. especially for the plating of lamp decoration and plastic parts

Bath composition and working conditions

Bath composition & Technical Data

 

 

Usable   Range

 

Standard

(CuSO4·5H2O)

200 – 220

(g/l)

220

(g/l)

(H2SO4)

55

– 70

(g/l)

60

(g/l)

(Cl - )

70

– 120

(mg/l)

80

(mg/l)

QRD – C

6 – 8

 

(ml/l)

8

(ml/l)

QRD – A

0.4

0.6

(ml/l)

0.6

(ml/l)

QRD – B

0.4

0.6

(ml/l)

0.4

(ml/l)

Temperature

20

– 35 ℃

 

24 – 28 ℃

CD in cathode

1 – 6

(A/dm2)

3 – 5 (A/dm2)

CD in anode

0.5–2.5 (A/dm2)

0.5–2.5 (A/dm2)

Anode

Copper anode(0.03-0.06%phosphorus)

Copper anode(0.03-0.06%phosphorus)

Voltage

1.5

6   (V)

1.5 – 6 (V)

Agitation

Air agitation or mechanical agitation.

Air agitation

3 Make up the solution

nFill up with tape water in 50% of the volume of the plating tank, heat the water until to 40 - 50℃. (The chloride ion content in the used water should be lower than 70mg/L.) then add the required copper sulfate with stirring until completely dissolved;

nAdd 2.0g/L activate carbon, stir it for more than one hour, then filter it into the clean plating tank, add tape water until to the working water level.

n Slowly add the required sulfuric acid with strongly stirring to ensure keeping the temperature of the bath solution is less than 60℃.

nMake the temperature of the bath solution cool to 25 ℃, then add hydrochloride acid or sodium chloride according to the chloride ion content in the bath solution to ensure the chloride ion content can reach the standard value.

Finally add the required quantity of additives, electrolyze for about 2 hours with 0.5 A/dm2 current. After that, the solution is readying for using.

4 Equipments

nPlating tank: steel tank or plastic tank with liner PVC or other plastic

nCooling machine: If the temperature of the bath solution is too high, it will cost a large

consumption of brightener; meanwhile it will result in a poor brightness in LCD area. Therefore, it is necessary to use the right cooling machine.

nCycle filter: The seston such as dust and lipin in the solution will result in rough deposit, pitting deposit, low brightening. It should adopt cycle filter to filter the solution. The filter pump can filter the solution for 4 times in one hour at least.

nAir agitation:  It should adopt enough strong air agitation to avoid pitting.

nCopper anode : The phosphorus content should be in 0.03 ~ 0.06%; If the phosphorus

content is too low, it is easy to appear burr due to copper powder; If the phosphorus content is too high, it will result in too thick phosphorus films on the anode surface to cause pitting or pinhole on the deposit.

nAnode bag : It should choose acidic & alkaline resistance polyester fiber bag with

double layer to avoid the anode dust gets into the solution.。

5Functions and addition of the brighteners

QRD – CQRD – C is not enough, the pitting will appear on the deposit, some loose striation deposit will appear on HCD or MCD area; EXULTRA – MU is excessive, it will appear fog deposit on LCD area.

QRD – A:When brightener EXULTRA – A is too low, the leveling will decrease on the plating layer; when brightener EXULTRA – A is excessive, the leveling on LCD area will decrease and form an obvious demarcation.

QRD – B  When brightener EXULTRA – B is not enough, the deposit will easy to get burnt; When brightener EXULTRA– B is excessive,it will result in fog on LCD area.

6 Consumption

QRD – C

30 – 80 ml/1000 A.H

QRD – A

50 – 90 ml/1000 A.H

QRD – B

30 – 80 ml/1000 A.H

 

Note: The above consumption quantity is only for reference, actual consumption is different according to different work pieces and process.


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